C3 Committee on Brazing and Soldering

C3 Committee on Brazing and Soldering

CHAIR: Ronald Smith, S-Bond Technologies
SECRETARY: John Douglass
COORDINATOR: Yojaidy Acosta
SCOPE: Responsible for the advancement of brazing and soldering technology through the development of specifications for the many brazing and soldering processes and filler metals. It actively pursues the expansion of brazing and soldering education through its ongoing involvement with creating university-level courses, its voluminous brazing handbook, as well as its International Brazing and Soldering Conference held every three years.

PUBLISHED DOCUMENTS

NEW DOCUMENTS UNDERGOING DRAFTING AND APPROVAL

  • C3.12M/C3.12, Specification for Furnace Soldering
  • C3.13M/C3.13, Specification for Controlled Atmosphere Brazing (CAB) of Aluminum
  • GHSP, Guideline for Hand Soldering Practices

LIST OF SUBCOMMITTEES

  • AWS C3A Subcommittee on the Brazing Handbook
  • AWS C3B Subcommittee on Soldering
  • AWS C3C Subcommittee on Brazing Education and Safety
  • AWS C3D Subcommittee on Brazing Specifications
  • AWS C3E Subcommittee on Brazing Conferences

JOIN THE COMMITTEE/SUBCOMMITTEE

The C3 Committee seeks volunteers to participate in its standards development process. Contact Secretary John Douglass to learn more about this committee’s work.