Plenary Sessions and Technical Program Day 1
Monday, April 27, 2009

Exhibit Hours: Noon - 7:00 pm
Lunch: Noon - 1:30 pm
Reception: 6:00 - 7:00 pm

Recently, growing restrictions for using alloys containing hazardous metals created an acute need to expand new brazing and soldering technologies. In this lecture, two examples will be presented on a progress in developments of filler materials: One involves applications in which drinking water is present and the second one describes a new advantageous brazing filler metals containing magnesium. New filler metals which contain less nickel and more iron than conventional BNi classifications were developed for brazing operations involving pipes and lines carrying drinking water. As a result, the strictly controlled nickel content of the drinking water that flows in brazed piping was reduced below 20 µg/l. It is well known that brazing filler metals containing magnesium show several problems associated with the oxide surface layer formation. This layer should be removed whereas the electrochemical corrosion due to direct contact between base and filler materials should be contained. New materials based on the Zn-Mg-Al compositions have also been developed. The relationships between their microstructure and mechanical properties will be presented as well.

About the Speaker:
Prof.-Dr. B. Wielage studied Mechanical Engineering at Paderborn and Hanover. Since 1973 Wielage has been involved with Joining Technologies at several places in Germany such as Bremen and Dortmund. He has a PhD and habilitation in the subject of high-temperature brazing and has been a Professor at the Chemnitz University of Technology and head of the Institute of Composite Materials since 1994 as well as the Dean of the Department of Mechanical Engineering since 2006.

The pace of change for soldering technology advancements in the electronics industry was fundamentally impacted in the late 1990's by the influence of "Green" legislative requirements. The electronics industry began undergoing a rapid materials evolution due to the Restriction of Hazardous Substances (RoHS) European, the Registration, Evaluation, Authorization and Restriction of Chemical substances (REACh) and other legislative activities. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are now engaged in multiple investigations to determine what lead-free material choices best fit their needs. This presentation will detail both the negative and positive aspects of the "Green" legislative requirement influence.

About the Speaker:
David D. Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his present assignment he serves as a consultant to manufacturing on material and processing problems. He has published 163 Industry papers with the 1997 ISHM Conference paper being selected as “Best Paper of Session”, the 2006 SMTAI Conference paper, the 2007 SMTAI Conference paper, and the 2008 SMTA International Conference on Soldering & Reliability being selected as “Best of Conference”. He has presented 11 Electronics Industry tutorials. Mr. Hillman was awarded the Da Vinci medal as a Rockwell Engineer of the Year for 1994. He serves as the Chairman of the IPC JSTD-002 and –003 Solderability committees. Mr. Hillman served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis prior to joining Rockwell. He serves as a member of the SMTA Journal and Soldering & Surface Mount Technology Journal Technical Paper Review committee. He is a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and Surface Mount Technology Association (SMTA) and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).

Monday, April 27, 2009
Technical Program – Day 1

Session Description: This session’s presentation cover a range of topics from new soldering processes to understanding the effect of alloys and processing steps on the metallurgical interactions between joined components. Learn about lead-free solders, the solder interactions with nanoparticles, solder creep behavior, induction soldering, free effect of metal plating layers, solder assembly of a printed circuits, fluxless ultrasonic soldering, and new solder developments.

• Fabrication of Maglev Vehicle Tract by Induction Soldering: Kenneth H. Holko, PE
• Effect of Base Metal Plating Layers on the Mechanical Strength of Au-Sn Solder Bonds: P. Vianco
• Fluxless ultrasonic soldering using a binary Sn-Al lead-free solder: Dr. Shankar Srinivasan
• Pb-Free Solder Assembly of a Printed Circuit Based Multi-Chip Module – A University/Industry Design Project Collaboration: Mike Powers
• Improving the Drop Impact Resistance of BGA Solder Joints by Use of SAC-Ti and SAC-Mn Solder Spheres: Weiping Liu
• Low-Temperature Joining by Using Metallic Nanoparticles: Prof-Dr J. Wilden
• Contribution to Creep Behavior of Al2O3-Particle-Reinforced SnAg-Solders: Sebastian Weis
• Variation of lead-free SnAgCu and SnCuNi solders influencing morphology and mechanical properties: Thomas Lampke
• Characterization of Very-Long-Term Aged 52In-48Sn (at.%) Solder Joints: Donald F. Susan
• Alloy Design of Sn-Ag-Cu+X Solder to Promote Eutectic Solidification: Iver E. Anderson
• Compression Stress-Strain Behavior of Sn-Ag-Cu Solder versus Sn-Pb Eutectic Solder: Edwin P. Lopez
• Improvement on The Properties and Microstructure of Sn-Ag-Cu Solder Bearing Rare Earth Ce: Xue Songbai
• Lead Free Joining in Electronic and Packaging Industries: Ajoy Kumar Ray

Dr. John Stephens Memorial Symposia — This session is dedicated to late Dr. John Stephens who made great contributions to the developments on establishing brazing process and developing new brazing filler metals for brazing non-metallic materials.

Session Description: This session presents new development and research activities in brazing non-metallic materials. Industrial applications for non-metallic materials have been expanding rapidly because of their inertness, low dielectric constant, high temperature mechanical properties etc. In most applications, there are need to join those material to metal or non-metallic material to non-metallic material. Brazing is one of the most economical methods for such joining applications. This session provides forefront technologies for brazing non-metallic materials. Engineers and students who are working on joining non-metallic materials will benefit by attending this session.

• The Life and Times of Dr. John J. Stephens Jr., Metallurgist Extraordinaire: Mr. F. Michael Hosking
• An alternative method for joining metal to ceramic with brazing filler metals in oxygen containing atmosphere: Michael Stefan Reichle
• Joining of RCC (Carbon/Carbon) Composites using Exothermic Assisted Techniques: Ronald Smith
• Microstructural Characterisation and Mechanical Testing of Rail Steel to Ceramics Active Brazed Joints: L. Nemeth-Wehrmann
• Hybrid Metal Composite for Electrical Connections in Power Electronics: Lichun Leigh Chen
• Physical-Chemical Basis for Brazing and Metallization of BaTiO3 Ceramic: Dr. Sydorenko T.V.
• Brazing of Copper-coated Carbon/Carbon Composites to Titanium Alloys: Toshi-Taka Ikeshoji
• Active Solder Joining of Graphite and Ceramic Components: Ronald Smith
• The Effect of the Porous Metal in Ceramics to Metal Brazed Joint: Tadashi Ariga
• Brazing of copper to alumina by reactive CuAgTi alloys: M. Braccini
• Brazing of Aluminum Nitride to Copper: Toshi Oyama
• The Brazing of Alumina and Zirconia to Columbium the Aid of the Nickel Interlayer: Dr. Durov O.V.