FIRST ANNOUNCEMENT

4th International Brazing & Soldering Conference (IBSC)
Orlando, Florida
Conference dates: April 26-29, 2009

Abstract Deadline: July 15, 2008     Manuscripts Due: October 15, 2008

The American Welding Society and ASM International® are again organizing its world recognized International Brazing & Soldering Conference (IBSC). This four-day event will begin with Short Courses offered on Sunday, followed by a three-day Technical Program Monday-Wednesday. IBSC brings together scientists, engineers and technical personnel from around the globe involved in the research, development, and application of brazing and soldering. Parallel sessions allow us to present the latest advances in these joining technologies and will be organized to permit interaction between the two disciplines.

IBSC 2009 Program Organizers invite to submit your work for consideration of inclusion in the technical program. They are accepting 150-200-word abstracts describing original, previously unpublished work. The work may pertain to current research, actual or potential applications, or new developments. Whereas commercialism must be avoided to maintain the high level of technical quality and integrity of the IBSC conferences, the new brazing applications and case histories are most welcome.

The technical program will include a special ½ day session focused on practical and innovative applications of brazing and soldering. The Tabletop Exhibit will provide a forum for commercial presentations and demonstrations of state-of-the-art brazing and soldering materials, processes and equipment. Check our website for details. The Poster Session will allow yet another opportunity to present the interesting developments in brazing and soldering technologies.

A Conference Proceedings containing only full manuscripts of the accepted research papers will be published to capture these high-quality technical presentations for later reference. Presentations focused on practical applications of brazing and soldering will also be included in the conference proceedings.

All abstracts submissions must be completed by close-of-business on Tuesday, July 15, 2008. Before submitting your abstract, we ask that you carefully consider your ability to present your work at the conference. Speakers are required to pay a (reduced) conference registration fee, and are totally responsible for their travel, housing and any related expenses. This premiere event is truly one that anyone involved in the brazing and soldering community should plan to attend.

Mark your calendar now, and if you are interested in presenting your work at the conference, submit your abstract no later than July 15, 2008.